Publication Date
2024
Document Type
Thesis
Committee Members
Ahsan Mian, Ph.D. (Advisor); Carrie M. Bartsch, Ph.D. (Committee Member); Daniel Young, Ph.D. (Committee Member)
Degree Name
Master of Science in Mechanical Engineering (MSME)
Abstract
Heterogeneous integration (HI) is currently being investigated to maintain the pace of technological progress in the electronics industry. With the recent acceleration witnessed in additive manufacturing (AM) technology, interest has been expressed in introducing aerosol jet (AJ) printing to the fabrication process for sensors and electronic packages. Integrating AM technology in these areas promises design flexibility and minimal material waste. Three AJ printed applications investigated in this work include strain sensors, electrical interconnects, and metal embedded chip assemblies. Before moving forward with the use of AJ printing in these applications, it is necessary to evaluate their performance under standard mechanical testing. This work aims to assess the mechanical reliability of devices and interconnects which are manufactured using hybridized AJ printing techniques. The devices considered for this research include three passivated strain gauges, three non-passivated strain gauges, 28 electrical interconnects, and three additive MECA packages. The mechanical reliability of samples are assessed by subjecting the samples to a variety of standardized tests including vibration, shock, and thermal loading while tracking their performance.
Page Count
76
Department or Program
Department of Mechanical and Materials Engineering
Year Degree Awarded
2024
Copyright
Copyright 2024, all rights reserved. My ETD will be available under the "Fair Use" terms of copyright law.
ORCID ID
0009-0005-9755-5751
