High Temperature Fatigue Crack Growth Behavior of Ti-6Al-4V

Authors

N. K. Arakere
Tarun Goswami, Wright State University - Main CampusFollow
J. Krohn
N. Ramachandran

Document Type

Article

Publication Date

9-27-2001

Abstract

Experimental evaluation of high temperature, Fatigue Crack Growth Rate (FCGR) data for Ti-6A1-4V, a titanium alloy, is presented. The FCGR data were measured at room temperature, 175, 230, 290 and 345°C using the Direct Current Potential Difference (DCPD) technique. Compact Tension (CT) specimens were used in the program and crack growth rates (da/dN) vs. Mode I stress intensity factor ranges (ΔΚ) were plotted as a function of temperature. A temperature rise from 175 to 345°C did not cause a substantial increase in crack growth rates within the Stage II region where a linear relationship describes the behavior. Fonnation of secondary cracks, observed at higher temperatures, may have slowed the crack propagation as observed in the fractography.

Comments

This work is licensed under a Creative Commons Attribution-NonCommercial-NoDerivs 3.0 Unported License.

Repository Citation

Arakere, N. K., Goswami, T., Krohn, J., & Ramachandran, N. (2001). High Temperature Fatigue Crack Growth Behavior of Ti-6Al-4V. High Temperature Materials and Processes, 21 (4), 229-236.
https://corescholar.libraries.wright.edu/bie/245

DOI

10.1515/HTMP.2002.21.4.229