Evaluation of Die Stress Using van der Pauw Sensors
Document Type
Conference Proceeding
Publication Date
1997
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Repository Citation
Mian, A.,
Suhling, J. C.,
Jaeger, R. C.,
& Wilamowski, B. M.
(1997). Evaluation of Die Stress Using van der Pauw Sensors. Proceedings of 1997 ASME International Mechanical Engineering Congress and Exposition, 22, 59-68.
https://corescholar.libraries.wright.edu/mme/392
Comments
Presented at the ASME International Mechanical Engineering Congress and Exposition, Applications of Experimental Mechanics to Electronic Packaging 1997, Dallas, TX, Nov. 16-21, 1997.