Copper Metallic Substrates for High Temperature Superconducting Coated Conductors
Document Type
Article
Publication Date
2005
Abstract
Biaxially cube textured polycrystalline Cu(200) substrate tapes were produced for high temperature superconducting (HTS) coated conductor applications. A comparison is made between Cu substrates fabricated by reverse cold rolling followed by recrystallization, from stock materials that were obtained in the form of extruded rod and rolled plate. Detailed x-ray diffraction (XRD) studies and orientation imaging microscopy (OIM) were performed to measure the in-plane alignment, out-of-plane alignment, and microtexture at various deformation levels and annealing temperatures. The rod starting geometry proved to have superior biaxial alignment with a predominant (220) deformation texture after rolling. Phi (Φ) scan and psi (Ψ) scan XRD reveals that the best in-plane and out-of-plane alignment, measured in terms of full width half maximum (FWHM) values of 5.4° and 5.8°, were obtained at 99.5% reduction in thickness and 750 °C annealing temperature. OIM microtexture results indicate that more than 97.5% of grains had less than 10° misorientation with no observable twinning.
Repository Citation
Yust, N. A.,
Nekkanti, R.,
Brunke, L. B.,
Srinivasan, R.,
& Barnes, P. N.
(2005). Copper Metallic Substrates for High Temperature Superconducting Coated Conductors. Superconductor Science and Technology, 18 (1), 9-13.
https://corescholar.libraries.wright.edu/mme/95
DOI
10.1088/0953-2048/18/1/002
