Copper Metallic Substrates for High Temperature Superconducting Coated Conductors
Biaxially cube textured polycrystalline Cu(200) substrate tapes were produced for high temperature superconducting (HTS) coated conductor applications. A comparison is made between Cu substrates fabricated by reverse cold rolling followed by recrystallization, from stock materials that were obtained in the form of extruded rod and rolled plate. Detailed x-ray diffraction (XRD) studies and orientation imaging microscopy (OIM) were performed to measure the in-plane alignment, out-of-plane alignment, and microtexture at various deformation levels and annealing temperatures. The rod starting geometry proved to have superior biaxial alignment with a predominant (220) deformation texture after rolling. Phi (Φ) scan and psi (Ψ) scan XRD reveals that the best in-plane and out-of-plane alignment, measured in terms of full width half maximum (FWHM) values of 5.4° and 5.8°, were obtained at 99.5% reduction in thickness and 750 °C annealing temperature. OIM microtexture results indicate that more than 97.5% of grains had less than 10° misorientation with no observable twinning.
Yust, N. A.,
Brunke, L. B.,
& Barnes, P. N.
(2005). Copper Metallic Substrates for High Temperature Superconducting Coated Conductors. Superconductor Science and Technology, 18 (1), 9-13.