Thermomechatronics of Power Electronics

Document Type

Conference Proceeding

Publication Date

1-1-2003

Identifier/URL

43035542 (Pure)

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Abstract

The coupled effects of mechanical stress and thermal expansion on the electrical function of power electronic circuits are explored within a new analytical framework called thermomechatronics. The problem of interest is the progressive performance degradation of the power electronics owing to the growth of thermomechanically induced fatigue cracks within the die-attach interlayer between power devices and substrates. Building on previous efforts, the present analysis focuses on experimentally confirming the system-level degradation of a simple power electronics circuit subject to variations in junction temperature of the electronics that would result from variations in interlayer damage.

DOI

10.1115/IMECE2003-41805

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