Identification and Correlation of Microstructural Defects With Flux Pinning in Ni-Doped Melt Textured YBa2Cu3O7-δ

Authors

V. Pavate, Purdue University
L. B. Williams, Purdue University
E. P. Kvam, Purdue University
Gregory Kozlowski, Wright State University - Main CampusFollow
W. Endres, Wright Patterson AFB
C. E. Oberly, Wright Patterson AFB

Document Type

Article

Publication Date

1994

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Abstract

Microstructural examination using transmission electron microscopy has been conducted on melt textured Ni‐doped and pristine YBaCu3O7−δ. Magnetization hysteresis suggests that the observed microstructural imperfections strongly influence flux pinning behavior. The investigation reveals a considerable difference in the density and distribution of stacking faults, especially near the grain boundaries. Dislocation nets and tangles were also observed in the Ni‐doped samples. It is proposed that the addition of Ni creates an excess of Cu which diffuses into the subgrains during oxygenation to be incorporated as stacking faults. Fine inclusions (25–50 nm) of Y2BaCuO5 were observed, suggesting that Ni refines the microstructure.

Repository Citation

Pavate, V., Williams, L. B., Kvam, E. P., Kozlowski, G., Endres, W., & Oberly, C. E. (1994). Identification and Correlation of Microstructural Defects With Flux Pinning in Ni-Doped Melt Textured YBa2Cu3O7-δ. Applied Physics Letters, 65 (2), 246-248.
https://corescholar.libraries.wright.edu/physics/1578

DOI

10.1063/1.112615